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Trüb AG expands its range of EMV smartcard solutions with CombOS Dual-Interface
Trüb AG, one of the world’s leading manufacturers of bank and charge cards as well as identity documents, is expanding its portfolio of EMV smartcard solutions with CombOS DI, a high performance dual-interface product that meets the latest standards. CombOS DI provides secure, rapid and reliable payment functionalities for debit or credit cards, both contact-based and contactless. CombOS is an operating system developed by Trüb for EMV smartcard solutions, and is in use with banks and financial institutions throughout the world.
The operating system CombOS developed by Trüb for EMV-compliant smartcard solutions is being expanded into a highly competitive offering with CombOS DI (Dual-Interface).
CombOS DI makes it possible to carry out on a single chip both contact-based and contactless payment transactions with debit or credit cards. In addition, CombOS DI enables the use of other applications, so that several functionalities can be combined simultaneously on one card: payments, authentication, loyalty and ticketing. The card thus becomes multifunctional, opening up new business opportunities and profiling potential for issuers.
Contactless payment transactions with CombOS DI are based on the EMV standards PayPass M/Chip of MasterCard (or PayPass Magstripe in USA) and payWave qVSDC of VISA (or payWave MSD in USA). For contact-based payment processes CombOS DI supports the applications M/Chip of MasterCard and VDSC of Visa.
In addition, loyalty applications are supported in compliance with ISO 7816 standards, contactless ticketing solutions with Mifare and authentication functions with CAP from MasterCard and DPA from VISA.
The high performance and processing speed of CombOS DI enable contactless transactions in well under 500 ms or half a second. Payment transactions can thus be made significantly faster than with cash!
The cost-effective production of cards is guaranteed through the compact and space-saving construction method of the 12 kB EEPROM as well as the specially developed antenna.
Thanks to this new antenna the cards can also be personalised with four lines of embossing.
Furthermore, the new CombOS DI-Chip is very efficient, in line with EMV CPS and simple to personalise.
A transfer from the current CombOS SDA or CombOS DDA to CombOS DI smartcards is thus possible.
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